HANS-5201S SMD Wire Bonder
HANS-5201S SMD Wire Bonder Wire Bonder Hans SMT Equipments and Machinery Johor Bahru (JB), Malaysia, Singapore, Melaka, Penang, Thailand Supplier, Suppliers, Supply, Supplies | GS Automation (M) Sdn Bhd

HANS-5201S SMD Wire Bonder

Bonding Cycle: 53ms/wire

Applicable to IC: SOT, SOP, SSOP, TSSOP, SOIC, QFP, DIP, BGA, COB, Opto-coupler etc.

Applicable to LED: 010, 020, 0201, 0402, 0603, 0805, 1206, 2835, 3014, 3020, 3528, 5050, 5630, 5730, COB, High-power etc.

Applicable to variable wire materials: gold/alloy/copper wire

Product advantages:

  • New generation high speed and high precision bonder electromechanical system, for higher UPH
  • World leading high speed and high precision XY electromechanical system
  • Continuous zoom optical lens
  • Two colors LED lighting, supporting side lighting
  • Material handling system with various materials
  • Supporting ahead recognition and other patterns, getting better recognition effect and speed with different materials
  • Friendly Windows UI, innovative online video help function
  • Chinese-English operation interface can be changed easily, without ON &OFF

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