HANS-5201S SMD Wire Bonder
Bonding Cycle: 53ms/wire
Applicable to IC: SOT, SOP, SSOP, TSSOP, SOIC, QFP, DIP, BGA, COB, Opto-coupler etc.
Applicable to LED: 010, 020, 0201, 0402, 0603, 0805, 1206, 2835, 3014, 3020, 3528, 5050, 5630, 5730, COB, High-power etc.
Applicable to variable wire materials: gold/alloy/copper wire
- New generation high speed and high precision bonder electromechanical system, for higher UPH
- World leading high speed and high precision XY electromechanical system
- Continuous zoom optical lens
- Two colors LED lighting, supporting side lighting
- Material handling system with various materials
- Supporting ahead recognition and other patterns, getting better recognition effect and speed with different materials
- Friendly Windows UI, innovative online video help function
- Chinese-English operation interface can be changed easily, without ON &OFF