GS129F Hoson SMT Equipments and Machinery Johor Bahru (JB), Malaysia, Singapore, Melaka, Penang, Thailand Supplier, Suppliers, Supply, Supplies | GS Automation Technology Pte. Ltd. GS Automation (M) Sdn Bhd

8 / 9

GS129F

Straight high speed solid crystal machine (Period: 180ms)
Applicable to iron, copper vertical LED

Long and short lead vertical LED lights automatic crystal of the best choice;
Vertical LED lights high-speed solid crystal (180ms / min, the hourly output of 15K), precision automation equipment for enterprises to improve production efficiency and reduce costs to provide effective protection, so as to effectively improve the competitiveness of enterprises;
The first domestic high-precision (double PR) + high-speed vertical LED solid crystal equipment;
Direct drive motor drive head;
Use a linear motor to drive the wafer search (X / Y) platform and feed B / C) platform
The use of new thermostatic dispensing system;
The use of mechanical feed system, to avoid pressure instability caused by feed is not smooth;
The use of box into the material to ensure that the lead frame will not collide with each other, resulting in unnecessary damage;
Vacuum leakage test;
IPC control equipment operation, simplifying the use of automated equipment.

1. System functions			3. Image recognition system
Production cycle	180ms (Depending on chip size and support)		Image Identification	256 grayscale
Chip size	5milx5mil-40milx40mil		Resolution	512x512 pixels
General vertical lead frame dimensions	long	5.7”-6.3”(145-160mm)	Image recognition accuracy	±0.025mil@50milObservation range
	high	0.92”-1.57”(23.5-40mm)	4. System accuracy
	thick	15mil-25mil(0.38-0.64mm)	XY	±1.5mil(±0.038mm）
	Distance	0.20”-0.47”(5-12mm)	BC	±1.5mil(±0.038mm）
Can hold up to material	2.5K		Chip rotation	±3°
2. Chip XY table			5. Welding head
Chip processor			Crystal arm	90° Rotatable welding
Maximum chip ring size	8”(212mm)Outside diameter		Crystal pressure	Adjustable 40g-250g
Maximum chip area size	7”(180mm)After expansion		6. Facilities required
Minimum chip ring size	6”(152mm)Outside diameter		Facilities required	220V AC ±5% / 50HZ
Minimum chip area size	4”(102mm)After expansion		Compressed air	5kg/cm²（MIN）
Chip workbench			Power consumption	650W
Maximum stroke	8”x8”(203mmx203mm)		Air consumption	5L/min
Resolution	1μm		7. Volume and weight
Repetition rate	2μm		Long x wide x high	130x80x230cm
Thimble Z height travel	80mil(2mm)		weight	750kg

GS129F