High Temperature Bakelite Nozzle - VESPEL ESEC
High Temperature Bakelite Nozzle - VESPEL ESEC Bakelite Nozzle Precision Molded Replaceable Rubber Tips Johor Bahru (JB), Malaysia, Singapore, Melaka, Penang, Thailand Supplier, Suppliers, Supply, Supplies | GS Automation Technology Pte. Ltd. GS Automation (M) Sdn Bhd


Bakelite nozzle, tungsten steel nozzle, used to pick and place, operation, patch needs special design tools. Using USA DuPont materials, the ability of 480 temperature suitable for the conditions of normal temperature and high temperature. The development of the bakelite nozzle, tungsten steel nozzle variety suitable for ASM, KNS, KAIJI, SHINKAWA, ESEC and other equipment, the minimum bore can be used for bonding, 0.08mm, eutectic or soft solder chip such as semiconductor, LED etc.. Can be customized according to the needs of customers processing.


Part No. D L (Length) A B
Diameter mm
ESEC-9.3MM-VES-CT-008-003 1.580 9.3 0.200 0.075
ESEC-9.3MM-VES-CT-008-004 1.580 9.3 0.200 0.100
ESEC-9.3MM-VES-CT-010-005 1.580 9.3 0.250 0.125
ESEC-9.3MM-VES-CT-012-006 1.580 9.3 0.300 0.150
ESEC-9.3MM-VES-CT-014-007 1.580 9.3 0.350 0.175
ESEC-11MM-VES-CT-008-004 1.580 11.0 0.400 0.200
ESEC-14MM-VES-CT-010-005 1.580 14.0 0.500 0.250
ESEC-15MM-VES-CT-030-015 1.580 15.0 0.750 0.375

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