GS129F
GS129F Hoson SMT Equipments and Machinery Johor Bahru (JB), Malaysia, Singapore, Melaka, Penang, Thailand Supplier, Suppliers, Supply, Supplies | GS Automation (M) Sdn Bhd

GS129F

Straight high speed solid crystal machine (Period: 180ms)
Applicable to iron, copper vertical LED

Model characteristics

  1. Long and short lead vertical LED lights automatic crystal of the best choice;
  2. Vertical LED lights high-speed solid crystal (180ms / min, the hourly output of 15K), precision automation equipment for enterprises to improve production efficiency and reduce costs to provide effective protection, so as to effectively improve the competitiveness of enterprises;
  3. The first domestic high-precision (double PR) + high-speed vertical LED solid crystal equipment;
  4. Direct drive motor drive head;
  5. Use a linear motor to drive the wafer search (X / Y) platform and feed B / C) platform
  6. The use of new thermostatic dispensing system;
  7. The use of mechanical feed system, to avoid pressure instability caused by feed is not smooth;
  8. The use of box into the material to ensure that the lead frame will not collide with each other, resulting in unnecessary damage;
  9. Vacuum leakage test;
  10. IPC control equipment operation, simplifying the use of automated equipment.

Specifications

1. System functions 3. Image recognition system
Production cycle 180ms (Depending on chip size and support) Image Identification 256 grayscale
Chip size 5milx5mil-40milx40mil Resolution 512x512 pixels
General vertical lead frame dimensions long 5.7”-6.3”(145-160mm) Image recognition accuracy ±0.025mil@50milObservation range
high 0.92”-1.57”(23.5-40mm) 4. System accuracy
thick 15mil-25mil(0.38-0.64mm) XY ±1.5mil(±0.038mm£©
Distance 0.20”-0.47”(5-12mm) BC ±1.5mil(±0.038mm£©
Can hold up to material 2.5K Chip rotation ±3°
2. Chip XY table 5. Welding head
Chip processor Crystal arm 90° Rotatable welding
Maximum chip ring size 8”(212mm)Outside diameter Crystal pressure Adjustable 40g-250g
Maximum chip area size 7”(180mm)After expansion 6. Facilities required
Minimum chip ring size 6”(152mm)Outside diameter Facilities required 220V AC ±5% / 50HZ
Minimum chip area size 4”(102mm)After expansion Compressed air 5kg/cm²£®MIN£©
Chip workbench Power consumption 650W
Maximum stroke 8”x8”(203mmx203mm) Air consumption 5L/min
Resolution 1μm 7. Volume and weight
Repetition rate 2μm Long x wide x high 130x80x230cm
Thimble Z height travel 80mil(2mm) weight 750kg

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